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1

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Werkhoven, Daniel, Vanderstraeten, Daniel, Blansaer, Eddy, Lannoo, Jonas, Pissoort, Davy

Year:

2019

Language:

english

File:

PDF, 796 KB

english, 2019

2

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.21 MB

english, 2012

3

[IEEE 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cracow, Poland (2020.7.5-2020.7.8)] 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Impact of PCB-housing-interaction on QFN solder joint reliability

Vandevelde, Bart, Labie, Riet, Vanderstraeten, Daniel, Blansaer, Eddy

Year:

2020

File:

PDF, 481 KB

2020

4

The study of Russian in Belgium

Koenraad Blansaer

Journal:

Russian Linguistics

Year:

1996

Language:

english

File:

PDF, 422 KB

english, 1996

5

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM

Ivankovic, A., Vanstreels, K., Hsu, YY, Gonzalez, M., Brizar, G., Vanderstraeten, D., Blansaer, E, Gillon, R., Defloor, Martijn, Vandaele, K., Degryse, D., Vandevelde, B.

Year:

2011

Language:

english

File:

PDF, 1.67 MB

english, 2011

6

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Flip chip based packaging solution for high current driver chips used in automotive applications

Vandevelde, B., Vandecasteele, B., Vanderstraeten, D., Brizar, G., Blansaer, E.

Year:

2008

Language:

english

File:

PDF, 17.51 MB

english, 2008

7

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Development of fast and easy methods for measuring the Young's modulus of molding compounds for IC packages

Ivankovic, Andrej, Vanstreels, Kris, Vanderstraeten, Daniel, Brizar, Guy, Gillon, Renaud, Blansaer, Eddy, Vandevelde, Bart

Year:

2010

Language:

english

File:

PDF, 1.04 MB

english, 2010

8

The Study of Russian in Belgium

Koenraad Blansaer

Journal:

Russian Linguistics

Year:

1996

Language:

english

File:

PDF, 883 KB

english, 1996

9

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Werkhoven, Daniel, Vanderstraeten, Daniel, Blansaer, Eddy, Lannoo, Jonas, Pissoort, Davy

Year:

2019

File:

PDF, 796 KB

2019